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description these high intensity blue, green, and cyan leds are based on the most effcient and cost effective ingan material technology. the 470 nm typical dominant wavelength for blue and 525 nm typical wavelength for green is well suited to color mixing in full color signs. the 505 nm typical dominant wavelength for cyan is suitable for traffc signal application. these led lamps are untinted, non-diffused, t-13/4 packages incorporating second generation optics which produce well-defned spatial radiation patterns at specifc viewing cone angles. these lamps are made with an advanced optical grade epoxy, offering superior temperature and moisture resistance in outdoor signal and sign applications. the high maximum led junction temperature limit of +110c enables high temperature operation in bright sunlight conditions. features ? well defned spatial radiation pattern ? high luminous output ? available in blue, green, and cyan color ? viewing angle: 15, 23 and 30 ? standoff or non-standoff leads ? superior resistance to moisture applications ? traffc signals ? commercial outdoor advertising ? front panel backlighting ? front panel indicator hlmp-cb11, hlmp-cb12, hlmp-cm11, hlmp-cm12, hlmp-ce11, hlmp-ce12, hlmp-cb26, hlmp-cb27, hlmp-cm26, hlmp-cm27, hlmp-ce26, hlmp-ce27, hlmp-cb36, hlmp-cb37, hlmp-cm36, hlmp-cm37, hlmp-ce36, hlmp-ce37 caution: devices are class 1c esd sensitive. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. hlmp-cxxx t-1 3 / 4 (5 mm) extra bright precision optical performance ingan led lamps data sheet
package dimensions package a package b 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 4.90 0.20 (0.193 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 8.61 0.20 (0.339 0.008) 2.54 0.38 (0.100 0.015) ? cathode lead 2.35 (0.093) max. cathode flat 5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015) ? cathode flat 1.14 0.20 (0.045 0.008) note 1 4.90 0.20 (0.192 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.50 0.15 (0.059 0.006) 1.00 (0.039) min. 8.61 0.20 (0.339 0.008) dimension h 0.50 0.10 (0.020 0.004) sq. typ. notes: 1. measured just above flange. 2. all dimensions are in millimeters (inches). 3. epoxy meniscus may extend about 1 mm (0.040") down the leads. 4. if heat sinking application is required, the terminal for heat sink is anode. dimension h: 15 = 10.80 0.25 mm (0.425 0.01 inch) 23 = 10.00 0.25 mm (0.394 0.01 inch) 30 = 11.27 0.25 mm (0.444 0.01 inch) cathode lead
device selection guide typical viewing angle, intensity (cd) at 20 ma package part number color 2 q 1 / 2 (degree) min. max. standoff dimension lens hlmp-cb11-tw0xx blue 15 .5 7. no a clear hlmp-cb11-uvbxx blue 15 . 5.5 no a clear hlmp-cb1 -tw0xx blue 15 .5 7. yes b clear hlmp-cm11-y 0xx green 15 9. 7.0 no a clear hlmp-cm11-z1cxx green 15 1.0 1.0 no a clear hlmp-cm1 -y 0xx green 15 9. 7.0 yes b clear hlmp-ce11-x10xx cyan 15 7. 1.0 no a clear hlmp-ce1 -x10xx cyan 15 7. 1.0 yes b clear hlmp-cb 6-sv0xx blue 1.9 5.5 no a clear hlmp-cb 6-tudxx blue .5 4. no a clear hlmp-cb 7-sv0xx blue 1.9 5.5 yes b clear hlmp-cm 6-x10xx green 7. 1.0 no a clear hlmp-cm 6-yzcxx green 9. 16.0 no a clear hlmp-cm 7-x10xx green 7. 1.0 yes b clear hlmp-ce 6-wz0xx cyan 5.5 16.0 no a clear hlmp-ce 7-wz0xx cyan 5.5 16.0 yes b clear hlmp-cb 6-qt0xx blue 0 1.15 . no a clear hlmp-cb 6-rsbxx blue 0 1.5 .5 no a clear hlmp-cb 7-ru0xx blue 0 1.5 4. yes b clear hlmp-cb 7-rsdxx blue 0 1.5 .5 yes b clear hlmp-cm 6-x10xx green 0 7. 1.0 no a clear hlmp-cm 6-xycxx green 0 7. 1 .0 no a clear hlmp-cm 7-x10xx green 0 7. 1.0 yes b clear hlmp-cm 7-xycxx green 0 7. 1 .0 yes b clear hlmp-cm 7-xydxx green 0 7. 1 .0 yes b clear hlmp-ce 6-wz0xx cyan 0 5.5 16.0 no a clear hlmp-ce 7-wz0xx cyan 0 5.5 16.0 yes b clear notes: 1. tolerance for luminous intensity measurement is 15%. . the luminous intensity is measured on the mechanical axis of the lamp package. . the optical axis is closely aligned with the package mechanical axis. 4. led light output is bright enough to cause injuries to the eyes. precautions must be taken to prevent looking directly at the led without proper safety equipment. 5. q 1/ is the off-axis angle where the luminous intensity is 1/ the on-axis intensity.
4 part numbering system hlmp? -? ? x? x? xx ? - ? x? x? x? xx mechanical ?options 00: bulk dd: ammo pack color ?bin?options 0: full color bin distribution b: color bin 2 and 3 c: color bin 3 and 4 d: color bin 4 and 5 maximum ? intensity?bin 0: no maximum intensity bin limitation others: refer to device selection guide minimum ? intensity?bin refer to device selection guide viewing ? intensity?bin 11: 15 without standoff 12: 15 with standoff 26: 23 without standoff 27: 23 with standoff 36: 30 without standoff 37: 30 with standoff color b: blue 470 nm m: green 525 nm e: cyan 505 nm package c: t-1 3 / 4 (5 mm) round lamp
5 absolute maximum rating at t a = 25 c parameters value unit dc forward current [1] 0 ma peak pulsed forward current [] 100 ma power dissipation 116 mw led junction temperature 10 c operating temperature range C40 to +85 c storage temperature range C40 to +100 c notes: 1. derate linearly as shown in figure . . duty factor 10%, frequency 1 khz. electrical/optical characteristics t a = 25 o c blue green cyan parameters symbol min. typ. max. min. typ. max. min. typ. max. units test condition forward voltage v f . .85 . .85 . .85 v i f = 0 ma reverse voltage [1] v r 5.0 5.0 5.0 v i r = 10 a thermal resistance r q j-pin 40 40 40 o c/w led junction to anode lead dominant l d 460 470 480 5 0 5 5 540 490 505 508 nm i f = 0 ma wavelength [] peak wavelength l peak 464 516 501 nm peak of wavelength of spectral distribu- tion at i f = 0 ma spectral half width dl 1/ 0 nm wavelength width at spectral distribu- tion power point at i f = 0 ma luminous effcacy [] h v 74 484 19 lm/w emitted luminous power/emitted radiant power notes: 1. the reverse voltage of the product is equivalent to the forward voltage of the protective chip at i r = 10 a. . the dominant wavelength, l d , is derived from the chromaticity diagram and represents the color of the lamp. . the radiant intensity, ie in watts/steradian, may be found from the equation ie = iv/ h v , where iv is the luminous intensity in candelas and h v is the lumi - nous effcacy in lumens/watt.
6 figure 5. relative intensity vs. dc forward current figure 4. relative dominant wavelength vs. dc forward current figure 1. relative intensity vs. wavelength figure 3. forward current vs. forward voltage figure 2. forward current vs. ambient temperature wavelength C nm relative intensity 380 430 480 530 580 630 680 1.0 cyan blue 0 0.8 0.6 0.4 0.2 green i f max. C maximum forward current C ma 0 0 t a C ambient temperature C c 50 80 35 10 5 15 10 20 30 40 60 70 90 20 25 30 r j-a = 780 c/w 0 35 10 5 0 3.0 30 25 20 15 2.0 1.0 forward current C ma forward voltage C v 4.0 dc forward current C ma relative dominant wavelength 0 1 0 1 5 5 2 0 2 5 3 0 1.035 1.025 1.030 0.990 1.015 1.020 1.010 1.005 1.000 0.995 blue green cyan 0 1.6 0.2 relative luminous intensity (normalized at 20 ma) dc forward current C ma 0 5 15 30 1.2 10 25 20 1.4 0.4 1.0 0.8 0.6
7 figure 6. spatial radiation pattern for cx11 and cx12 figure 7. spatial radiation pattern for cx26 and cx27 figure 8. spatial radiation pattern for cx36 and cx37 normalized intensity 1 0 angular displacement C degrees 0.5 -90 -60 0 -30 30 60 90 normalized intensity 1 0 angular displacement C degrees 0.5 -90 -60 0 -30 30 60 90 normalized intensity 1 0 angular displacement C degrees 0.5 -90 -60 0 -30 30 60 90
8 intensity bin limit table intensity (mcd) at 20 ma bin min max n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 500 t 500 00 u 00 400 v 4 00 5500 w 5500 7 00 x 7 00 900 y 9 00 1000 z 1 000 16000 1 16000 1000 tolerance for each bin limit is 15%. blue color bin table bin min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0 97 0.1766 0.0966 0.1818 0.0904 0.1 74 0.074 464.0 468.0 0.1 74 0.0 74 0.1699 0.106 0.1766 0.0966 0.1 91 0.0495 468.0 47 .0 0.1 91 0.0495 0.1616 0.109 0.1699 0.106 0.1187 0.0671 4 47 .0 476.0 0.1187 0.0671 0.1517 0.14 0.1616 0.1 09 0.106 0.0945 5 476.0 480.0 0.106 0.0945 0.1 97 0.178 0.1517 0.14 0.091 0.17 tolerance for each bin limit is 0.5 nm. cyan color bin table bin min dom max dom xmin ymin xmax ymax 1 490.0 495.0 0.0454 0. 945 0.1164 0.889 0.1 18 0. 06 0.0 5 0.417 495.0 500.0 0.0 45 0.41 7 0.1057 0.4769 0.1164 0. 889 0.008 0.584 500.0 505.0 0.008 0.5 84 0.10 7 0.5584 0.1057 0.4769 0.00 9 0.6548 4 505.0 510.0 0.00 9 0.6548 0.1097 0.651 0.10 7 0.5584 0.01 9 0.750 7 498.0 50 .0 0.01 0.488 0.10 8 0.57 0.109 0.4417 0.0040 0.6104 8 50 .0 508.0 0.0040 0.6104 0.1056 0.6007 0.10 8 0.57 0.0080 0.715 tolerance for each bin limit is 0.5 nm. green color bin table bin min dom max dom xmin ymin xmax ymax 1 5 0.0 5 4.0 0.074 0.8 8 0.1856 0.6556 0.1650 0.6586 0.1060 0.8 9 5 4.0 5 8.0 0.1060 0.89 0. 068 0.646 0.1856 0.6556 0.1 87 0.8148 5 8.0 5 .0 0.1 87 0.8148 0.7 0.644 0. 068 0.646 0.170 0.7965 4 5 .0 5 6.0 0.170 0.7965 0. 469 0.61 0.7 0.6 44 0.00 0.7764 5 5 6.0 540.0 0.00 0.7764 0. 659 0.6070 0. 469 0.61 0. 96 0.754 tolerance for each bin limit is 0.5 nm.
9 precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress in - duced into the led package. otherwise, cut the leads to applicable length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress, due to lead cutting, from traveling to the led chip die attach and wirebond. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59 mm. soldering the led closer than 1.59 mm might damage the led. ? recommended soldering conditions: manual solder wave soldering dipping pre-heat temperature 105 c max. C pre-heat time 0 sec max. C peak temperature 50 c max. 60 c max. dwell time sec max. 5 sec max. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? at elevated temperature, the led is more susceptible to mechanical stress. therefore, pcb must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fxtures or pallet. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.0 5 inch) (0.0 8 to 0.04 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.0 0 x 0.0 0 inch) (0.0 8 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to daily check on the soldering profle to ensure the soldering profile is always conforming to recommended soldering condition. notes: 1. pcb with different size and design (component density) will have different heat mass (heat capacity). this might cause a change in temperature experienced by the board if samewave soldering setting is used. so, it is recommended to recalibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness leds use a high effciency led die with single wire bond, as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c. over-stressing the led during soldering process might cause premature failure to the led due to delamination. note: electrical connection between bottom surface of led die and the lead frame material through conductive paste of solder. avago technologies led confguration ingan device ? over sizing of plated through hole can lead to twisting or improper led placement during auto insertion. under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. 1.59 mm anode
recommended wave soldering profle ammo packs drawing 10 laminar wa ve bo tt om side of pc bo ard ho t air knife turbulent wa ve fluxing prehea t 0 1 0 2 0 30 50 100 150 200 250 30 40 50 time ? seconds tempera ture ? c 60 7 0 8 0 9 0 100 t op side of pc bo ard convey or speed = 1.83 m/min (6 ft/min) prehea t setting = 150 c (100 c pcb) solder wa ve tempera ture = 245 c 5 c air knife air tempera ture = 390 c air knife dist ance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma lead-free solder: 96.5% sn; 3% ag; 0.5% cu no te: allo w for bo ards t o be sufficientl y cooled before exer ting mechanical force. 18.00 0.50 (0.7087 0.0197) 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) 9.125 0.625 (0.3593 0.0246) 12.70 0.30 (0.50 0.0118) cathode 0.70 0.20 (0.0276 0.0079) 20.50 1.00 (0.807 0.039) a a view aCa ? 4.00 0.20 (0.1575 0.008) typ. all dimensions in millimeters (inches). note: the ammo-packs drawing is applicable for packaging option -dd & -zz and regardless of standoff or non-standoff.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 2008 avago technologies limited. all rights reserved. obsoletes 5989-4115en av02-0367en march 6, 2008 packaging box for ammo packs disclaimer avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss damage, expense or liability in connection with such use. from left side of box, adhesive tape must be facing upward. avago technologies anode mother label cathod e c a + C anode lead leaves the box first. note: for ingan device, the ammo pack packaging box contains esd logo. label on this side of box.

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